濕式工作台:     
1.濕式工作台 (Wet Bench)
                                       
爐管系統(Furnace Systems)
1.氧化擴散系統 (Oxidation & Diffusion Furnaces )

2.快速退火系統 (Rapid Temperture Annealing, RTA)

微影系統(Lithograph
沉積系統(Chemical Vapor Deposition Systems)
1.低壓化學氣相沉積系統 (Low Pressure Chemical Vapor Deposition, LPCVD)
2.電漿輔助化學氣相沉積系統 (Plasma-Enhanced Chemical Vapor Deposition, PECVD)

3.原子層化學氣相沉積系統(Atomic Layer Chemical Vapor Deposition System, ALD)

微影系統(Lithography Systems)
1.光罩製作系統(雷射圖形產生系統)  (Laser Pattern Generator, DWL-200)

2.圖形產生系統(Pattern Generator)

曝光機 (屬貴儀機台之曝光機請至貴儀系統中之””光罩對準曝光機Aligner預約)
1.R120黃光周邊附屬機台 (Litho Accessories Machine)
2.雙面光罩對準曝光機(A) (Double Side Mask Aligner (A))

3.雙面光罩對準曝光機(B) (Double Side Mask Aligner (B))

蝕刻系統(Dry Etch Systems)
1.導電性材料活性離子蝕刻機:
(1).複晶矽活性離子蝕刻系統 (Poly-Si Reactive Ion Etching System, Poly-Si RIE)
(2).高密度活性離子蝕刻系統 (High Density Plasma Reactive Ion Etching System, HDP-RIE)
(3).矽深蝕刻系統(Si Deep-RIE)
2.介電性材料活性離子蝕刻系統:
(1).介電材料活性離子蝕刻系統 A(Dielectric Materials Reactive Ion Etching SystemRIE-400iP-1
(2).介電材料活性離子蝕刻系統 B(Dielectric Materials Reactive Ion Etching System, RIE 200L
(3).介電質蝕刻系統 (Dielectric Materials Reactive Ion Etching SystemRIE-400iP-2

蒸鍍系統(Vacuum Deposition Systems)
1.熱蒸鍍系統:
(1).熱阻絲蒸鍍系統 (Thermal Evaporation Coater)
(2).雙電子槍蒸鍍系統 A (Dual E-Gun Evaporation System A)
(3).雙電子槍蒸鍍系統 B (Dual E-Gun Evaporation System B)
2.高真空鍍膜系統:
(1).真空濺鍍系統 A (Sputtering System A)
(2).真空濺鍍系統 B (Sputtering System B) 
(3).高真空鍍膜系統 (High Vacuum Deposition System)

3.(電子系設備)電子槍蒸鍍系統 (E-Beam Evaporator System) (鍍金,現金付費)

分析系統(Analysis Systems)
1.聚焦離子束與電子束顯微系統 (Dual beam [focused ion beam & electron beam] System)  FIB
2.冷場發射掃描式電子顯微鏡暨能量散佈分析儀器 (SEM SU-8010) (Cold Field Emission Scanning Electron Microscope (Hitachi SU8010) & Energy Dispersive Spectrometer)
3.高解析度場發射掃描電子顯微鏡暨能量散佈分析儀 (SEM S-4700I) (High-Resolution Cold Field Emission Scanning Electron Microscope & Energy Dispersive Spectrometer, SEM, EDS)
6.四點探針 (4-point Probe)
7.橢圓測試儀 (Ellipsometer)
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